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近日，南浔区举行项目签约仪式，晶洲长三角TGV玻璃基板半导体工艺装备研发及产业化项目、玻璃基板PVD镀膜设备研发及生产项目签约落户南浔。据悉，苏州晶洲装备科技有限公司是目前国内唯一具备大尺寸整线湿法供

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http://www.hwenz.com/pic/感情夜听文章十大年夜劣良的文章，感情文章颁收的仄台.jpg

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三星电子设备解决方案DS）部门已着手开发下一代封装材料“玻璃中介层”，目标不仅是取代昂贵的硅中介层，还要提升芯片性能。据报导，三星电子最近收到澳洲材料商Chemtronics和南韩设备商Philopt

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